MECHANIC XG-50 Solder Paste (35gm) – 183°C Melting Point

MECHANIC Solder Paste XG-50 (35gm) – Sn63/Pb37 Alloy, 183°C Melting Point

The MECHANIC XG-50 Solder Paste (35gm) is a premium leaded solder paste, featuring a Sn63/Pb37 alloy with a low melting point of 183°C. Specifically designed for SMD soldering, PCB assembly, and electronic repairs, it delivers precise, reliable, and strong solder joints for both manual and automated processes.

With a 3-micron particle size and excellent wetting properties, this solder paste ensures smooth flow, preventing cold solder joints and bridging. The 35g container allows for easy, mess-free application, making it ideal for DIY projects, rework, and professional electronics manufacturing.

Key Features:

• Low Melting Point: 183°C for efficient, controlled soldering.

• High-Quality Joints: Provides clean, durable, and reliable connections.

• Excellent Wetting: Smooth flow prevents defects like bridges or cold joints.

• Convenient Packaging: 35g jar for ease of use and minimal waste.

• Versatile: Suitable for PCB assembly, SMD soldering, and rework.

• Non-Corrosive: Safe for sensitive electronic components.

Specifications:

• Product Type: Solder Paste

• Weight: 35g

• Melting Point: 183°C

• Composition: Flux and solder powder (Sn63/Pb37 alloy)

• Viscosity: Medium

• Application: PCB assembly, electronics soldering, SMD rework

• Compatibility: Manual and automated soldering

• Package Type: Jar

• Storage: Store in a cool, dry place

Applications:

• PCB Assembly & SMD soldering.

• Electronics repair and rework.

• DIY electronics projects.

• Automated soldering machines.